Micro-Credential in Rf Mems Technology

Duration

2 Months (8 Weeks)

Mode of Delivery

Online/ Face to Face

Online

Application

Programme Overview

The trend toward device miniaturization and large-scale integration, which has already revolutionized electronic devices, now promises a profound transformation of engineered electro-mechanical systems, reducing their size by orders of magnitude while vastly increasing their capabilities. Micro electromechanical systems (MEMS) are now found in automotive, computer projectors, digital cameras, gyroscopic sensors, and many other devices. Their small size invites a high degree of on-chip integration with essential drive, detection, and signal conditioning circuitry. This course introduces the fundamental theory, design and fabrication of Micro electromechanical System.

Learning Outcomes

On completion of the course participants should be able to:

• Describe the importance of miniaturization of devices and understand the principal law of scaling.
• Formulate the various coupled electro- mechanical systems mathematically.
• Evaluate the fabrication process and micro machining of complex electromechanical system.
• Design the miniature sensors and actuators through mathematical formulations.
• Prepare an assignment based on the topics related to RF MEMS Technology using valid online resources.
• Present a topic on RF MEMS Technology.

Course Progression

Credits from this Micro-Credential Programme are transferable to the following full academic programme:

  • Master of Science in Telecommunication Engineering

Assessments

  • Continuous Assessment 60%
  • Final Examination 40%

Study Plan for Micro-Credential in RF MEMS Technology

Week 1

(6 Hrs.)

 

Introduction

  • The History of MEMS development
  • The Intrinsic Characteristics of MEMS Devices: Sensors and Actuators

 

 

 

First-Pass Introduction to Micro fabrication

  • Overview of Micro fabrication
  • Essential Overview of frequently Used Micro fabrication processes
  • The Microelectronics fabrication Process
  • Flow Silicon-based MEMS processes
  • Packaging and Integration
  • New Materials and fabrication Processes
  • Process Selection and design

Discussions

Week 2

(6 Hrs.)

 

 

Review of Essential Electrical and Mechanical Concepts

  • Conductivity of semiconductors
  • Crystal Planes and orientations
  • Stress and Strain
  • Flexural Beam Bending
  • Analysis under Simple loading Conditions
  • Torsional Deflections Intrinsic Stress
  • Dynamic System
  • Resonant Frequency, and Quality Factor
  • Active Tuning of Spring constant and Resonant frequency

 

Electrostatic Sensing and Actuation

  • Introduction to Electrostatic sensors and Actuators
  • Parallel Plate Capacitor
  • Applications of Parallel-Plate Capacitors
  • Inter digital finger capacitors
  • Applications of Comb-Drive devices

Discussions

Week 3

(6 Hrs.)

 

 

Thermal Sensing and Actuation

  • Introduction
  • Sensors and Actuators based on Thermal expansion
  • Thermal Couples
  • Thermal Resistors
  • Applications

 

Piezo resistive Sensors

  • Origin and Expression of piezo resistivity
  • Piezo resistive Sensor Materials
  • Stress Analysis of mechanical elements
  • Applications of Piezo resistive Sensors

 Discussions

 

Week 4

(6 Hrs.)

 

 

Piezoelectric Sensing and Actuation

  • Introduction
  • Properties of Piezoelectric materials
  • Applications

 

Magnetic Actuation

  • Essential Concepts and Principles
  • Fabrication of Micro Magnetic Components
  • Case Studies of MEMS
  • Magnetic Actuators

Discussions

Written Test

Week 5

(6 Hrs.)

 

 

Summary of Sensing and Actuation Methods

  • Comparison of Major sensing and Actuation methods
  • Other Sensing and Actuation Methods

 

Bulk Micromachining and Silicon Anisotropic Etching

  • Introduction
  • Anisotropic Wet Etching
  • Dry Etching and Deep Reactive Ion Etching
  • Isotropic Wet Etching
  • Gas Phase Etchants
  • Native Oxide
    Special Wafers and Techniques

 

Discussions

Week 6

(6 Hrs.)

 

 

Surface Micromachining

  • Basic Surface Micromachining Processes
  • Structural and Sacrificial Materials
  • Acceleration of Sacrificial etch Stiction and Anti-stiction Methods

 

Process Synthesis: Putting It all Together

  • Process for Suspension beams
  • Process for Membranes

Discussions

Presentation

Week 7

(6 Hrs.)

 

 

Process Synthesis: Putting It all Together

  • Process for Cantilevers
  • Practical Factors Affecting yield of MEMS

 

Polymer MEMS

  • Introduction Polymers in MEMS
    representative
  • Applications

Submission of Assignments

 

Week 8

 

Final Examination

Conclusion Session

Awarding of Certificates

Presentation by VC or Representative of VC

 

Why Micro-Credential in Lincoln University College (LUC), Malaysia?

Micro-credentials in Lincoln University College (LUC), Malaysia offer a flexible, targeted, and accelerated pathway of acquiring industry-relevant skills that meet the demands of today’s evolving job market. Designed for students, professionals, and individuals seeking to upskill or reskill, credentials offer learning experiences and formally recognized certifications, with enhanced employability, and serving as stepping stones to higher qualifications. LUC’s micro-credential programs are supported by strong academic frameworks and offer clear progression pathways into full-fledged degree programs. After completing this Micro-credential course, professionals can use their updated skills to apply for promotions or switch to a different job role.

Help us to guide you better

Thank you for visiting lincoln.edu.my
So that we can guide you accurately and show you the most relevant information, please fill up the details below. 

Help us to guide you better

Thank you for visiting lincoln.edu.my
So that we can guide you accurately and show you the most relevant information, please fill up the details below. 

 

Verify Result/Certificate


 

E-mail: verify@testing.lincoln.edu.my

 

EasyTransfer

USDMYR

Bank Transfer

Flywire

USDMYR